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The Jinguanming PCBA Solution Development Division mainly collaborates strategically with world-renowned chip manufacturers, specializing in the development of solutions for three major functional areas: optical modules and TYPE C connectors, as well as computer boards and high-speed data transmission function cards.

SMT Assembly Division, under the lean production concept, adapts to the diverse production needs of small batches in the current environment; To achieve high requirements, high quality, and on-time production services;

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R&D Process

R&D Process

SMT Surface Mount
1
DIP Welding
2
Test
3
Burn
4
Assemble
5
Conformal Coating
6

SMT Prototype Display

SMT Prototype Display

Yamaha YSM20 SMT Machine

Support PCB size: 50 * 50MM-400 * 340MM • SMT accuracy: 0.025mm

Component size: 01005

Maximum supported material types: 318

Zhengshi fully automatic printing machine

Minimum size for PCB placement: 400 * 340mm

System alignment accuracy and repeatability accuracy: ± 0.01MM

Actual solder paste printing accuracy: ± 0.025MM

Production Line Configuration

Production Line Configuration

Total Length Of Production Line
15.28M
Maximum Width
2.35M
Quantity Of Labor
2 Of Them
Component Range
01005 - 90x 120mm QFP(0.3mm pitch) & BGA/CSP(0.25mm pitch)
Component Height
Up to 30mm
Max Line Output (KCPH)
60000 (CHIP only)

SMT Detection

SMT Detection

Standard equipment includes solder paste 3D inspection equipment (SPI) and automatic optical inspection instruments (AOI) before and after reflow oven to ensure printing quality and surface mount quality.

Configure X-ray detector (X-RAY) to analyze chip components, accurately locate and improve defects.

AOI Detector

SPI Detector

X-ray Detector